| 摘要 |
A heatsink assembly includes a heatsink having a base board which includes fins extending from a top thereof and a recessed area defined in an underside thereof. The recessed area of the heatsink is adapted for engagement with a chip set. A positioning device includes a rectangular frame that is mounted to the heatsink and includes two side plates extending downward from two opposite sides thereof. Each side plate has a hook extending from an inside thereof so as to hook the chip set. Two flexible rods extend from the two opposite sides of the rectangular frame and each flexible rod has a pressing portion which presses on the top of the base board of the heatsink.
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