发明名称 Methods for producing lead-free in-situ composite solder alloys
摘要 Methods are disclosed for producing in-situ composite solders having a particulate intermetallic phase homogeneously distributed throughout the solder matrix. An eutectic solder is mixed with the components of the intermetallic phase, melted and rapidly cooled to form the desired solder. In-situ composite solder alloys formed by the disclosed method provide greater solder joint strength and fatigue resistance.
申请公布号 US7771547(B2) 申请公布日期 2010.08.10
申请号 US20030730398 申请日期 2003.12.08
申请人 BOARD OF TRUSTEES OPERATING MICHIGAN STATE UNIVERSITY 发明人 BIELER THOMAS R.;SUBRAMANIAN KARATHOLUVU N.;CHOI SUNGLAK
分类号 B22D17/00;B23K35/02;B23K35/26;B23K35/34;C22C1/02;H05K3/34 主分类号 B22D17/00
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