<p>PURPOSE: A method for forming a connection terminal including a solder unit and a solder unit supporter is provided to efficiently reduce an external impact by changing the propagation direction of a crack. CONSTITUTION: A substrate with a UBM(Under Bump Metallurgy)(116) is prepared. A solder unit(141) comprised of a lower side of a cylindrical shape and an upper side of a sphere shape is formed. The lower side is combined with the UBM. A solder unit supporter(130) is formed on the substrate and surrounds the lower side. The solder unit supporter is arranged on the UBM.</p>
申请公布号
KR20100087564(A)
申请公布日期
2010.08.05
申请号
KR20090006655
申请日期
2009.01.28
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, MYEONG SOON;AHN, EUN CHUL;CHUNG, HYUN SOO;KIM, SEOK HO;CHOI, DO YEON;CHUN, JIN HO