| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a miniaturized sensor made using a planar technique. <P>SOLUTION: The present invention includes a surface type MEMS sensor such that it has (a) a first region of semiconductor material, referred to as a "thick region" which shows a first thickness forming at least one mobile set; (b) a second region of semiconductor material which forms at least one pivot link in the mobile set to substrate and has a shaft of the pivot link, running in parallel with the plane of the substrate; and (c) a third region called as a thin region which extends in the plane parallel to plane of the substrate which does not include the pivot link shaft, extends in the plane perpendicular to torsion axis of the pivot, and is combined with the mobile set on one side, while being combined with the substrate on the other side. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
