| 摘要 |
PROBLEM TO BE SOLVED: To provide a workpiece housing mechanism and a workpiece housing method avoiding collision of a cassette with a workpiece in the workpiece with a reinforcing protrusion formed on its outer peripheral region. SOLUTION: The workpiece housing mechanism includes: a carry-in/carry-out arm 14 for holding a recessed bottom surface 65a of a workpiece which includes a device forming region 62 in which a device 61 is formed and the outer peripheral region 63 surrounding the device forming region 62 on its front surface and in which a region formed on its rear surface corresponding to the device forming region 62 is removed to form a recessed part 65 and for housing a semiconductor wafer W in a V-shaped groove 27 formed in a carry-out cassette 3; and an alignment part for moving the carry-in/carry-out arm 14 relative to the carry-out cassette 3 in housing the semiconductor wafer W to correct for the amount corresponding to the depth of the recessed part 65 to align the semiconductor wafer W with the V-shaped groove 27. COPYRIGHT: (C)2010,JPO&INPIT |
