| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board excelling in dimensional accuracy and flatness. SOLUTION: In this multilayered wiring board including a plurality of flat layers 211-215 for at least either of power and grounding along with wires in an insulating base body 1 with a plurality of glass ceramic insulating layers 11-18 laminated therein, at least an upper flat layer and a lower flat layer vertically adjacent to each other within the flat layers 211-215 arranged among the different glass ceramic insulating layers 11-18 have areas different from each other; and the outer edge of the upper flat layer and that of the lower flat layer are arranged not to overlap with each other when viewed in the lamination direction, and not to intersect with each other. COPYRIGHT: (C)2010,JPO&INPIT |
