| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit wiring board having a minute fine pitch, high dimension accuracy and reliability of bonding between a circuit wiring and an insulating resin layer by preventing the deterioration of dimension accuracy of a wiring having a formed pattern which is caused by heat treatment in a process of manufacturing the circuit wiring board. SOLUTION: The circuit wiring board is manufactured by forming a wiring by reduction processing and plating processing in a state where an application film formed by applying an application liquid containing a polyimide precursor resin and a metal compound and drying the film is laminated on a metallic sheet-like support member; forming an insulating resin layer by subjecting the polyimide precursor resin layer to heat treatment to imidize it; and separating the sheet-like support member from the insulating resin layer. COPYRIGHT: (C)2010,JPO&INPIT
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