SUBSTRATE COMPRISING ALLOY FILM OF METAL ELEMENT HAVING BARRIER FUNCTION AND METAL ELEMENT HAVING CATALYTIC POWER

摘要

Disclosed are: a layer which has a catalytic power and a barrier function and exhibits excellent coverage and film uniformity in the form of an extremely thin film; a preliminary processing technique which is capable of forming a thin and uniform seed layer that enables formation of ultra-fine wiring patterns; and a substrate which contains a seed layer that is formed to have a thin and uniform film thickness by electroless plating utilizing the preliminary processing technique. Specifically disclosed is a substrate which is characterized in that an alloy film of one or more metal elements which have a barrier function and are selected from among tungsten, molybdenum and niobium, and a metal element which is composed of ruthenium and/or platinum and has a catalytic power for electroless plating is formed on a base by a chemical vapor deposition (CVD) process in a thickness of 0.5-5 nm, and that the alloy film has a composition in which the metal elements having a barrier function are contained in an amount of not less than 5% by atom but not more than 90% by atom.