发明名称 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
摘要 The semiconductor device, which provides reduced electric current leakage and parasitic resistance to achieve stable current gain, is provided. A first polycrystalline semiconductor layer is grown on a p-type polycrystalline silicon film exposed in a lower surface of a visor section composed of a multiple-layered film containing a p-type polycrystalline silicon film and a silicon nitride film, while growing the first semiconductor layer on a n-type collector layer, and then the first polycrystalline semiconductor layer is selectively removed. Further, a second growing operation for selectively growing the second polycrystalline semiconductor layer and the third polycrystalline semiconductor layer on the exposed portion of the p-type polycrystalline semiconductor film exposed in the lower surface of the visor section without contacting the silicon nitride film, while growing the second semiconductor layer and the third semiconductor layer, so that the third semiconductor layer is in contact with the third polycrystalline semiconductor layer.
申请公布号 US2010197122(A1) 申请公布日期 2010.08.05
申请号 US20100759091 申请日期 2010.04.13
申请人 NEC ELECTRONICS CORPORATION 发明人 ONO MASATAKA;FUJITA AKIKO
分类号 H01L21/20;H01L21/36 主分类号 H01L21/20
代理机构 代理人
主权项
地址