| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition meeting requirements as a photoresist film used for a gold plating solder resist, for example, and to provide a photoresist film using the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition comprises a base polymer component (A), an ethylenically unsaturated monomer component (B), and a photopolymerization initiator (C). The ethylenically unsaturated monomer component (B) contains a bifunctional (meth)acrylic monomer (B1) having the structure -(X)n-, wherein X is an oxyalkylene group or alkylene group, n is an integer of 1 or more, m is an integer of 1 or more when m represents the carbon number of a main chain in X, and the equation (1): Σ(m×n)=35-150 is satisfied. <P>COPYRIGHT: (C)2010,JPO&INPIT |
