HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET

摘要

Disclosed is a heat-conductive pressure-sensitive adhesive composition comprising boron nitride particles and an acrylic polymer component, from which a molded article having a high heat conductivity can be formed. Also disclosed is a heat-conductive pressure-sensitive adhesive sheet using the aforesaid heat-conductive pressure-sensitive adhesive composition, which has a high heat conductivity and an excellent adhesion force. Specifically disclosed is a heat-conductive pressure-sensitive adhesive composition comprising boron nitride particles and an acrylic polymer component, characterized by containing boron nitride particles having a particle diameter of 3-300 µm inclusive as the aforesaid boron nitride particles, and the aforesaid boron nitride particles comprising 5-45% by volume of boron nitride particles having a particle diameter of 3-20 µm inclusive, 30-70% by volume of boron nitride particles having a particle diameter greater than 20 µm but not greater than 60 µm, and 10-40% by volume of boron nitride particles having a particle diameter greater than 60 µm but not greater than 300 µm.