| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method improving a yield by enhancing adhesion between a conductive layer and an insulating layer in a multi-layer wiring board with the conductive layer stacked via the insulating layer. SOLUTION: A polyimide insulating layer 13 is formed on a first wiring pattern 12a by using a photosensitive polyimide precursor. A contact hole 14 is formed on the polyimide insulating layer 13 through photolithography as shown in Fig.1(3) (and not shown here). Then, after oxygen plasma treatment is carried out, the wiring board is immersed in a 0.95% (weight percentage) aqueous acidic solution of ammonium hydrogen fluoride NH<SB>4</SB>F-HF(NH<SB>4</SB>F:HF=1:1) for 20 seconds. COPYRIGHT: (C)2010,JPO&INPIT |
