发明名称 Light emitting diode package
摘要 <p>PURPOSE: A light-emitting diode package prevents from the foreign material penetrating into the interface between the base and the lens. The lifetime of the light-emitting diode package is improved. CONSTITUTION: The light emitting diode chip(30) is prepared. The light emitting diode chip is mounted in the lead frame(20). The lens(40) is formed into the transparent resinous material. In order to surround the border in which the base(10) and lens are close anti-penetration member(50) is formed. Anti-penetration member prevents the penetration of the foreign material through border.</p>
申请公布号 KR100974338(B1) 申请公布日期 2010.08.05
申请号 KR20080116407 申请日期 2008.11.21
申请人 发明人
分类号 H01L33/48;H01L33/52 主分类号 H01L33/48
代理机构 代理人
主权项
地址