SOCKET, SEMICONDUCTOR DEVICE, AND METHOD FOR EVALUATING RELIABILITY OF SOCKET

摘要

PROBLEM TO BE SOLVED: To evaluate the reliability of electrical connection of an LGA (land grid array) socket for connecting a semiconductor package to a circuit substrate via conductive terminals having creep characteristics. SOLUTION: The socket includes a plurality of conductive terminals 11 having creep characteristics; a support plate 12 supporting the upper and lower ends of the conductive terminals 11 in the upward and downward projected state; a frame body 13 for supporting the peripheral part of the support plate 12; and a load-measuring element for measuring the vertical load applied to the frame body 13. The load dispersed on the frame body 13 by the creepage of the conductive terminals 11 is measured to be known for the change in the load applied to the conductive terminals 11, and reliability is evaluated based on the load change. COPYRIGHT: (C)2010,JPO&INPIT