发明名称 JET SOLDER BATH
摘要 <p>The height of molten solder which is jetted from the tip of a nozzle is made uniform. A bath body (2) contains molten solder (20), a pump pressure-feeds the molten solder (20) contained in the bath body (2), a first duct (4) guides the molten solder (20) pressure-fed by the pump in the inflow direction (P1), a direction changing section (9) changes the inflow direction (P1) of the molten solder (20) which is guided by the first duct (4) to the inflow direction (P2), and a second duct (5) guides the molten solder (20) which is changed to the inflow direction (P2) by the direction changing section (9) to a nozzle body (6) in the inflow direction (P3).  Since the direction changing section (9) prevents generation of turbulence of the molten solder (20) when the inflow direction (P1) of the molten solder (20) is changed to the inflow direction (P2) by the direction changing section (9), the current velocity and flow rate of the molten solder (20) which is guided from the second duct (5) to the nozzle body (6) are stabilized.  As a result, the height of the molten solder (20) which is jetted from a nozzle mouth (3) can be made uniform.</p>
申请公布号 WO2010087341(A1) 申请公布日期 2010.08.05
申请号 WO2010JP50981 申请日期 2010.01.26
申请人 SENJU METAL INDUSTRY CO., LTD.;ICHIKAWA HIROKAZU;HOSOKAWA KOUICHIRO;SUZUKI TAKASHI 发明人 ICHIKAWA HIROKAZU;HOSOKAWA KOUICHIRO;SUZUKI TAKASHI
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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