| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem raised by a semiconductor element for a liquid crystal driver that an increase in a pressurizing force is caused and gives damage to the element at the time of connecting the element to a circuit board due to an increased number of electrode pads. SOLUTION: In a semiconductor device, the semiconductor element 4 is connected to a wiring pattern 2 provided on a substrate 1 constituting the circuit board 3 through bump electrodes 5 of the element 4. Since the wiring pattern 2 connected to the bump electrodes 5 has a disconnected portion 7 and the electrodes 5 are connected to the pattern 2 in the disconnected portion 7, the pattern 2 is dividedly brought into contact with two spots of each electrode 5 on the front and rear sides. In addition, since the bump electrodes 5 cause mechanical plastic deformation even when weak pressurizing forces are applied to the electrodes 5, a strong connecting structure is formed and stable damage- free micro connection becomes possible. |
