| 摘要 |
Disclosed is a device for applying drywall tape and grouting compound to drywall. The invention is operative to simplify the application of drywall tape and an appropriate amount of grouting compound to a joint. Conveniently, the device is placed on a standard size tub of drywall grouting compound, such that compound adheres the drywall tape as it is drawn through the device by one applying tape to a joint to be filled. Various embodiments of the present invention permit the easy application of tape and compound to joints on flat surfaces as well as in corners.
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