| 摘要 |
PURPOSE: A substrate for a semiconductor package and a semiconductor package having the same are provided to improve the reliability of the semiconductor package by preventing the separation of ball land pattern form a connection member. CONSTITUTION: A semiconductor package substrate is composed of a substrate body(10), a connection pad(20), a ball land pattern(30), a solder resist pattern(40), and a assistant ball land pattern(50). The substrate body has a first side and a second plane facing it, and connection pads are arranged on the first plane. The ball land pattern is arranged on the second side and is connected with the connection pad electrically. The solder resist pattern has an opening through which the ball land pattern is exposed. |
