发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus where contact and spacing deviation do not occur between a pattern formed on a substrate in a preprocess by a laser beam and a pattern formed on the substrate in the postprocess by a laser beam. <P>SOLUTION: The laser beam machining method for machining and forming a prescribed pattern on a substrate (K) by relatively driving the substrate (K) and a laser beam (b2), includes: a copy original line data acquisition step (S200) where data specifying the shape of the first pattern (LA1) formed on the substrate (K) in the preprocess are acquired as copy original line data (D2); and a second pattern formation step (S300) where, on the basis of the copy original line data (D2), the substrate (K) and the laser beam (b2) are relatively driven so as to form a second pattern (L1) in such a manner that a locus that the laser beam (b2) traces in the postprocess is made into a shape copying the shape of the first pattern (LA1). <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010162586(A) 申请公布日期 2010.07.29
申请号 JP20090008341 申请日期 2009.01.19
申请人 TORAY ENG CO LTD 发明人 TAO MASANORI;UCHIGATA TOMOO;HAMAKAWA NAOYOSHI;WADA HIROMITSU
分类号 B23K26/00;B23K101/40;H01L31/04 主分类号 B23K26/00
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