发明名称 |
LEAD FRAMES WITH IMPROVED ADHESION TO PLASTIC ENCAPSULANT |
摘要 |
A lead frame and an electronic package having improved adhesion between the lead frame and an encapsulating plastic material is disclosed. The lead frame can be preplated having an outer layer comprising a precious metal such as palladium or gold to which is adhered a self-assembled monolayer (SAM), such as a SAM derived from an organophosphorus acid. The organophosphorus acid preferably is a mixture in which the organo groups are fluoro substituted hydrocarbons and hydrocarbons containing ethylenically unsaturated groups. |
申请公布号 |
WO2010085319(A1) |
申请公布日期 |
2010.07.29 |
申请号 |
WO2010US00091 |
申请日期 |
2010.01.15 |
申请人 |
ACULON, INC. |
发明人 |
HANSON, ERIC, L.;BRUNER, ERIC, L.;GOTRO, JEFFREY |
分类号 |
H01L23/495;H01L23/31 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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