发明名称 DEVICE AND METHOD FOR MOLDING COIL
摘要 PROBLEM TO BE SOLVED: To improve productivity while suppressing the deformation of a molded coil. SOLUTION: A device for molding a coil includes a wire leading-out machine 22 linearly leading out a wire 9 extended from a supply source 21, a plurality of holders 23 to 26 mutually holding the wire at regular intervals, a holder moving means 31 configured so as to be able to move a plurality of holders, and a controller 46 controlling the holder moving means 31. A method for molding the coil repeats a wire holding process for holding the wire linearly led out by the plurality of holders linearly mounted mutually at regular intervals, a wire molding process for simultaneously moving the plurality of holders and bending and molding the wire in a specified shape, a wire leading-out process for linearly leading out the wire by the quantity equal to the overall length of the wire forming the specified shape from the supply source, and a holder return process for detaching the plurality of holders from the wire bent and molded in the specified shape and mutually fitting the holders linearly again at regular intervals. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010166765(A) 申请公布日期 2010.07.29
申请号 JP20090008711 申请日期 2009.01.19
申请人 NITTOKU ENG CO LTD 发明人 HONDA HIDEMITSU
分类号 H02K15/04 主分类号 H02K15/04
代理机构 代理人
主权项
地址