发明名称 Polysilicon field ring structure for power ic
摘要 A polysilicon field ring structure is used to eliminate any type of unwanted surface current leakage in an integrated power chip having high voltage and low voltage areas and enclosed in a plastic housing. All P-type diffusions not biased to the ground potential are surrounded by rings biased to the supply potential, and all N-type diffusions not biased to the supply potential are surrounded by rings biased to the ground potential.
申请公布号 GB9509964(D0) 申请公布日期 1995.07.12
申请号 GB19950009964 申请日期 1995.05.17
申请人 INTERNATIONAL RECTIFIER CORPORATION 发明人
分类号 H01L27/04;H01L21/3205;H01L21/76;H01L21/822;H01L21/8234;H01L21/8238;H01L23/52;H01L27/088;H01L27/092;H01L29/06;H01L29/40;H01L29/78 主分类号 H01L27/04
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