发明名称 METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To provide an improved mounting method and apparatus for accurately mounting conductive balls on the arrangement in a predetermined pattern. SOLUTION: The method is used to mount balls on the arrangement by filling the conductive balls on recesses formed on at least one surface of the arrangement in a predetermined pattern. A transferring tool includes a plurality of elastic linear members disposed closely with axes thereof nearly aligned such that the linear members are arranged while being nearly horizontally abuttable with the balls supplied to one surface of the arrangement. The method includes a step of relatively horizontally moving the transferring tool against the surface of the arrangement while the linear members are pressed on the surface of the arrangement. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010166067(A) 申请公布日期 2010.07.29
申请号 JP20100037049 申请日期 2010.02.23
申请人 HITACHI METALS LTD 发明人 ITO MOTOMICHI
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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