发明名称 |
TRANSPARENT CONDUCTIVE FILM ENCAPSULATING MESH-LIKE STRUCTURE FORMED FROM METAL MICROPARTICLES, SUBSTRATE ON WHICH TRANSPARENT CONDUCTIVE FILM IS LAMINATED, AND METHOD FOR PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a transparent conductive film encapsulating a mesh-like structure formed from metal microparticles with high transmittance and high conductivity with a flat surface and excellent in heat resistance and weather resistance, as well as a substrate on which the transparent conductive film is laminated, and to provide a manufacturing method of the substrate. SOLUTION: As shown in Fig.1, the transparent conductive film 4 is an oxide film mainly composed of silicon oxide encapsulating the mesh-like structure 1 formed from the metal microparticles. Further, the transparent conductive film is laminated on a glass substrate 11 or a ceramic substrate to obtain the substrate on which the transparent conductive film is laminated. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010165638(A) |
申请公布日期 |
2010.07.29 |
申请号 |
JP20090009136 |
申请日期 |
2009.01.19 |
申请人 |
TODA KOGYO CORP;FUJICOPIAN CO LTD |
发明人 |
KAKIHARA YASUO;SUZUKI KYOICHI |
分类号 |
H01B5/14;B32B7/02;B32B18/00;H01B13/00 |
主分类号 |
H01B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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