发明名称 TRANSPARENT CONDUCTIVE FILM ENCAPSULATING MESH-LIKE STRUCTURE FORMED FROM METAL MICROPARTICLES, SUBSTRATE ON WHICH TRANSPARENT CONDUCTIVE FILM IS LAMINATED, AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a transparent conductive film encapsulating a mesh-like structure formed from metal microparticles with high transmittance and high conductivity with a flat surface and excellent in heat resistance and weather resistance, as well as a substrate on which the transparent conductive film is laminated, and to provide a manufacturing method of the substrate. SOLUTION: As shown in Fig.1, the transparent conductive film 4 is an oxide film mainly composed of silicon oxide encapsulating the mesh-like structure 1 formed from the metal microparticles. Further, the transparent conductive film is laminated on a glass substrate 11 or a ceramic substrate to obtain the substrate on which the transparent conductive film is laminated. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010165638(A) 申请公布日期 2010.07.29
申请号 JP20090009136 申请日期 2009.01.19
申请人 TODA KOGYO CORP;FUJICOPIAN CO LTD 发明人 KAKIHARA YASUO;SUZUKI KYOICHI
分类号 H01B5/14;B32B7/02;B32B18/00;H01B13/00 主分类号 H01B5/14
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