| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for reinforcing an FPC board (flexible printed circuit board), excellent in tightness to a commercial adhesive sheet as a reinforcing film for the FPC board, and capable of preventing separation and a blister from being generated partially on a bonded interface, even when the FPC board and a reinforcement plate are bonded using the commercial adhesive sheet, in a solder reflow process, an FPC board reinforcement plate, and an FPC board laminate. SOLUTION: This film for reinforcing the flexible printed circuit board includes a biaxially oriented polyester film base material layer, wherein a polyester of the base material is a polyethylene naphthalate, and wherein a heat shrinkage rate of the reinforcing film is -1 to 1% or less in both directions of film longitudinal and width directions, when heat-treated at 200°C for 10 minutes, and has a coarse face having 500 nm or more to 1,000 nm or less of average surface roughness Ra in at least one face of the base material layer. COPYRIGHT: (C)2010,JPO&INPIT
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