发明名称 |
Electromagnetic bandgap structure and printed circuit board |
摘要 |
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.
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申请公布号 |
US7764149(B2) |
申请公布日期 |
2010.07.27 |
申请号 |
US20080007122 |
申请日期 |
2008.01.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HAN MI-JA;KIM HAN;PARK DAE-HYUN;JUNG HYO-JIC |
分类号 |
H01P1/203;H01P5/08 |
主分类号 |
H01P1/203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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