发明名称 Electromagnetic bandgap structure and printed circuit board
摘要 An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.
申请公布号 US7764149(B2) 申请公布日期 2010.07.27
申请号 US20080007122 申请日期 2008.01.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HAN MI-JA;KIM HAN;PARK DAE-HYUN;JUNG HYO-JIC
分类号 H01P1/203;H01P5/08 主分类号 H01P1/203
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