发明名称 Method of interconnect formation using focused beams
摘要 A method of forming an electrical interconnect, which includes a first electrode, an interlayer of a programmable material disposed over at least a portion of the first electrode, and a second electrode disposed over the programmable material at a non-zero angle relative to the first electrode. The interlayer includes a modified region having differing electrical properties than the rest of the interlayer, sandwiched at the junction of the first electrode and the second electrode. The interlayer may be exposed to a focused beam to form the modified region.
申请公布号 US7763552(B2) 申请公布日期 2010.07.27
申请号 US20060413476 申请日期 2006.04.28
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 TONG WILLIAM M.;STEWART DUNCAN;WILLIAMS R. STANLEY;SHARMA MANISH;LI ZHIYONG;GIBSON GARY A.
分类号 H01L21/768;H01L21/62 主分类号 H01L21/768
代理机构 代理人
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