| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of forming a laser machined groove of a desired width without separating a laminate from a semiconductor substrate. <P>SOLUTION: The apparatus includes: a laser beam irradiation means for emitting a laser beam to a workpiece held on a chuck table; a feeding-of-work means for relatively moving the chuck table in the X axis direction; and an indexing-feeding means for relatively moving the chuck table in the Y axis direction. The laser beam irradiation means is composed of a laser beam oscillation means for oscillating a laser beam and a light condensing lens that converges the laser beam oscillated from the laser beam oscillation means to emit it to the workpiece held on the chuck table. The laser beam irradiation means is provided with an energy distribution correcting means which is arranged between the laser beam oscillation means and the light condensing lens and which forms, in a vertical distribution, the Gaussian foot part of the energy distribution in the Y axis direction of the laser beam oscillated from the laser beam oscillation means, and with an energy density adjusting means which adjusts the energy density in the X axis direction of the laser beam. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
