发明名称 PLASMA TREATMENT APPARATUS, IMPEDANCE MATCHING DEVICE, COUPLER
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus to which an electric circuit is electrically stably attached. <P>SOLUTION: A socket 40 provided in an output portion of an impedance matching device is provided with an inserting hole 41 for inserting and holding a power supply bar 32 into a center of a metal body 40a formed in a cylindrical shape. A coated layer 42 including an insulator is provided in an inner wall of the inserting hole 41, and a space between the socket 40 and the power supply bar 32 is electrically insulated. High frequency electric power generated with a second high frequency power supply 51 is transferred to the power supply bar 32 by inductive coupling. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010159493(A) 申请公布日期 2010.07.22
申请号 JP20100016012 申请日期 2010.01.27
申请人 TOKYO ELECTRON LTD 发明人 HIGASHIURA TSUTOMU
分类号 C23C16/505;H01L21/3065;H01L21/31;H05H1/46 主分类号 C23C16/505
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