发明名称 |
PLASMA TREATMENT APPARATUS, IMPEDANCE MATCHING DEVICE, COUPLER |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus to which an electric circuit is electrically stably attached. <P>SOLUTION: A socket 40 provided in an output portion of an impedance matching device is provided with an inserting hole 41 for inserting and holding a power supply bar 32 into a center of a metal body 40a formed in a cylindrical shape. A coated layer 42 including an insulator is provided in an inner wall of the inserting hole 41, and a space between the socket 40 and the power supply bar 32 is electrically insulated. High frequency electric power generated with a second high frequency power supply 51 is transferred to the power supply bar 32 by inductive coupling. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010159493(A) |
申请公布日期 |
2010.07.22 |
申请号 |
JP20100016012 |
申请日期 |
2010.01.27 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
HIGASHIURA TSUTOMU |
分类号 |
C23C16/505;H01L21/3065;H01L21/31;H05H1/46 |
主分类号 |
C23C16/505 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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