| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate with a through-hole electrode, capable of responding to further high density without deterioration of substrate strength, and a method of manufacturing the same. Ž<P>SOLUTION: The method of manufacturing a substrate with a through-hole electrode includes: forming, on a conductive substrate, a projection part having a side surface substantially vertical to the substrate surface; bonding the conductive substrate to an insulating substrate constituted by a material lower in melting point than the material constituting the conductive substrate so as to embed the projection part; polishing the insulating substrate to expose the projection part; and forming a through-hole in the projection part by etching the exposed projection part in the thickness direction of the conductive substrate to form a plurality of divided electrodes. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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