发明名称 |
PROGRAMMABLE THROUGH SILICON VIA |
摘要 |
Through silicon vias (TSVs) in silicon chips are both programmable and non-programmable. The programmable TSVs may employ metal/insulator/metal structures to switch from an open to shorted condition with programming carried out by complementary circuitry on two adjacent chips in a multi-story chip stack. |
申请公布号 |
US2010182040(A1) |
申请公布日期 |
2010.07.22 |
申请号 |
US20090357659 |
申请日期 |
2009.01.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FENG KAI DI;HSU LOUIS LU-CHEN;WANG PING-CHUAN;YANG ZHIJIAN |
分类号 |
H03K19/173;H01L21/44;H01L23/02;H01L29/00;H01L29/40 |
主分类号 |
H03K19/173 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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