| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip resistor and a method of making the same, wherein failures such as breakage of a substrate made of an insulating material can be avoided even when the chip resistor is made compact and thin. <P>SOLUTION: The chip resistor A includes the substrate 1, a pair of electrodes 2, a resistive layer 3, and a protective layer 4. The substrate 1 is made of the insulating material. The electrodes 2 are formed on a one surface 1a of the substrate 1 and spaced apart from each other. The resistive layer 3 is formed on the one surface 1a of the substrate 1 and electrically connected to the pair of electrodes 2. The protective layer 4 is provided to cover the resistive layer 3. The one surface 1a is a mount side surface. Each of the electrodes 2 includes electrode layers (first electrode layer 21 and second electrode layer 22) electrically connected to the resistive layer 3, and a plating layer 23 formed on the electrode layers. The boundary between the electrode layer and the plating layer 23 is positioned closer to the substrate 1 than the end surface of the protective layer 4 in the thickness direction of the substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
