| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate coating method for lithography that enables pattern formation which gives high resolution, a proper pattern shape and proper line edge roughness and attains reduction in the outgas, at the same time, by inhibiting the water repelling on a resist surface before development due to a hydrophilic-hydrophobic rugged structure and allowing development to proceed evenly and uniformly, particularly in electron beam, X-ray or EUV lithography in an ultrafine region, and to provide an actinic ray-sensitive or radiation-sensitive resin composition suitable for the method. <P>SOLUTION: The substrate coating method for lithography includes the steps of coating the top of a substrate with a film, by using an actinic ray-sensitive or radiation-sensitive resin composition, and forming a topcoat layer on the film using a topcoat composition, wherein an actinic ray-sensitive or radiation-sensitive resin composition containing (B), a compound which decomposes upon irradiation with actinic rays or radiation and generates an acid, in an amount of at least 10 mass%, relative to the total solid content in the composition, is used as the actinic ray-sensitive or radiation-sensitive resin composition. <P>COPYRIGHT: (C)2010,JPO&INPIT |
