Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

摘要

The present invention provides a molecular sieve carbon having such a structure that a large number of carbon primary particles three-dimensionally irregularly overlap and coalesce with each other, wherein the average particle diameter of said carbon primary particles is not more than 10 µm, the coefficient of variation of the particle size distribution of said primary particles expressed in the following formula [1] is not more than 0.65: coefficient of variation of particle size distribution of carbon primary particles = standard deviation of carbon primary particle diameters / average particle diameter of carbon primary particles and a particle bulk density is 0.7 to 1.2 g/cc.