| 摘要 |
PURPOSE: To produce a prepreg without causing the mark of a resin powder when used in a laminated sheet or a printed wiring board. CONSTITUTION: After the resin powder or foreign matter bonded to the surface of a prepreg set to a predetermined dimension by cutting the periphery thereof is removed by pretreatment, the prepreg is heated to re-melt the surface and periphery thereof before cooled. |
