| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure of a semiconductor device in which a gold ball such as an Au bump is bonded to an Au electrode by solid phase diffusion, and the quality of the bonded part is easily determined. <P>SOLUTION: An Au fine crystal film having smaller crystal grains than Au electrode crystal grains is formed on the Au electrode. The Au bump is pressure bonded to the Au electrode on which the Au fine crystal film is formed. Thereby, it becomes easy to confirm re-crystallized grains formed over the bonded surface between the Au fine crystal film and the Au bump by enlarging the cross section of a first electrode and the Au bump for observation and the quality is determined. <P>COPYRIGHT: (C)2010,JPO&INPIT |
