| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed circuit board having excellent connecting reliability and electrical characteristics. SOLUTION: The method for manufacturing the multilayer printed circuit board comprises (a) a step of forming a metal layer on the multilayer printed circuit board, (b) a step of sequentially forming an opening at the metal layer and the board and forming a through hole at the board formed with the metal layer by forming the opening, (c) a step of pretreating the board formed with the hole by using a pretreating liquid for electroless plating containing an alkaline compound of 0.0 to 0.25 mol/l and an aqueous solution containing a reducing agent of 0.1 to 0.3 mol/l, (d) a step of forming an electrolessly plating film on a surface of the pretreated board, (e) a step of forming a plating resist on a part of the electrolessly plating film, (f) a step of forming an electrolytically plating film on the plated resist non-forming part, and (g) a step of releasing the plating resist and then removing the electrolessly plating film under the plating resist and the metal layer. |
