发明名称 Thermal barrier coating systems
摘要 <p>Coating system for a metallic substrate includes a strengthened bond coat including a bond coat inner layer and an aluminum-containing layer overlying the bond coat inner layer. The bond coat inner layer is formed by deposition of a bond coat composition including, in weight percent, 14-20% Cr, 5-8% Al, 8-12% Co, 3-7% Ta, 0.1-0.6% Hf, 0.1-0.5% Y, up to about 1% Si, 0.005-0.020% Zr, 0.04-0.08% C, 0.01-0.02% B, with a remainder including Ni and incidental impurities, wherein the bond coat composition is substantially free of rhenium. The coating system includes an optional thermal barrier coating which may be a yttria-stabilized zirconia.</p>
申请公布号 GB201010137(D0) 申请公布日期 2010.07.21
申请号 GB20100010137 申请日期 2008.12.11
申请人 GENERAL ELECTRIC COMPANY 发明人
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