发明名称 |
Substrate for semiconductor package |
摘要 |
A substrate for a semiconductor package comprises a dielectric substrate, a circuit pattern, and an electromagnetic band gap (EBG) pattern. The circuit pattern is formed on a first surface of the dielectric substrate and is connected to ground via a ground connection. The electromagnetic band gap (EBG) pattern comprises a plurality of zigzag unit structures formed on a second surface of the dielectric substrate, wherein the second surface is formed on an opposite side of the dielectric substrate from the first surface; the zigzag unit structures are electrically connected to each other; and at least one of the zigzag unit structures is electrically connected to the ground connection.
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申请公布号 |
US7760044(B2) |
申请公布日期 |
2010.07.20 |
申请号 |
US20070761416 |
申请日期 |
2007.06.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG EUN-SEOK;LEE HEE-SEOK;LIM SO-YOUNG |
分类号 |
H04B3/28 |
主分类号 |
H04B3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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