| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that thermal expansion or thermal contraction causes distortion at a solder joint of a lead. <P>SOLUTION: A top end 114 in which a recess 202 for receiving a solder ball of a BGA component is formed at a lead 106 of an adapter which electrically connects the BGA component to a circuit board, a pin-like bottom end 116 which is soldered to a pad pattern on the circuit board, a support that is fitted to a non-conductive carrier, and a hinge 204 are formed integrally. The hinge 204 has a solid structure having four bends for accommodating thermal expansion and contraction of a solder joint. In order to accommodate deformation of the hinge 204, a gap 350 is provided at a member 304 on the side opposite to the hinge 204. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
