发明名称 Thermal hinge for lid cooling
摘要 A thermal hinge couples a computing platform to a lid. The thermal hinge includes a hinge block that has a groove passing through the hinge block and a hinge pillar to couple to the lid. The hinge pillar is inserted in a first end of the groove passing through the hinge block. The thermal hinge also includes a thermally conductive conduit inserted in a second end of the groove passing through the hinge block. The thermally conductive conduit couples with a heat spreader in the lid in order to transfer thermal energy from the hinge block to the heat spreader.
申请公布号 US2008130221(A1) 申请公布日期 2008.06.05
申请号 US20060607629 申请日期 2006.12.02
申请人 VARADARAJAN KRISHNAKUMAR;MONGIA RAJIV;POKHARNA HIMANSHU 发明人 VARADARAJAN KRISHNAKUMAR;MONGIA RAJIV;POKHARNA HIMANSHU
分类号 G06F1/20 主分类号 G06F1/20
代理机构 代理人
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