发明名称 |
Thermal hinge for lid cooling |
摘要 |
A thermal hinge couples a computing platform to a lid. The thermal hinge includes a hinge block that has a groove passing through the hinge block and a hinge pillar to couple to the lid. The hinge pillar is inserted in a first end of the groove passing through the hinge block. The thermal hinge also includes a thermally conductive conduit inserted in a second end of the groove passing through the hinge block. The thermally conductive conduit couples with a heat spreader in the lid in order to transfer thermal energy from the hinge block to the heat spreader.
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申请公布号 |
US2008130221(A1) |
申请公布日期 |
2008.06.05 |
申请号 |
US20060607629 |
申请日期 |
2006.12.02 |
申请人 |
VARADARAJAN KRISHNAKUMAR;MONGIA RAJIV;POKHARNA HIMANSHU |
发明人 |
VARADARAJAN KRISHNAKUMAR;MONGIA RAJIV;POKHARNA HIMANSHU |
分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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