| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with high assembly accuracy and high reliability, in which laminated semiconductor chips are mounted and also thin semiconductor chips with large warpages can be easily positioned. <P>SOLUTION: In welding and connecting semiconductor chips 1 each of which includes hollow silicon through electrodes 4 having tapered parts 8 by using solder balls each of which has a core 6 of a material whose melting point is higher than that of solder, temperature is increased while applying press load to the laminated semiconductor chips 1 to correct warpages of the semiconductor chips 1 and connect respective semiconductor chips 1, wherein, a solder ball with a core 6 whose diameter is shorter than that of other connection portions is used for a connection portion for preventing the generation of stress around the electrode 4 due to the press charge. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
