| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad for an increase in wafer yield by increasing removal rate to increase throughput. <P>SOLUTION: The polishing pad includes a center, an inner region surrounding the center, and a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with high-rate paths. The transition region is adjacent to the outer region and within a radius from the center defined as follows, and the inner region is to be the origin of continuous grooves extended without a break to the outer region. <P>COPYRIGHT: (C)2010,JPO&INPIT |
