| 摘要 |
<P>PROBLEM TO BE SOLVED: To excellently connect semiconductor chips on an upper and a lower surface of a lead frame to the lead frame and to each other when the semiconductor chips are mounted on both upper and lower surfaces of the lead frame. <P>SOLUTION: A semiconductor device includes a circuit base (lead frame) 1 having an inner lead portion 2 and first and outer lead portion 3 and 4. The inner lead portion 2 has a plurality of inner leads 5, 6 and 7, at least part of the inner leads is routed around in a chip mounted region X. The first and second semiconductor chips 8 and 9 are mounted on both upper and lower surfaces of the circuit base 1. At least part of electrode pads 10 of the first semiconductor chip 8 are electrically connected to electrode pads of the second semiconductor chip 9 through the inner leads 7. <P>COPYRIGHT: (C)2010,JPO&INPIT |
