| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device prevented in development of a crack around a bump and therefore disconnection or short-circuiting of a circuit by dispersing stress applied to the bump, and improved in connection reliability when mounted on a mounting board. <P>SOLUTION: This semiconductor device 1 includes: a semiconductor substrate 10 with an electrode 2 formed on one surface thereof; a first insulation resin layer 11 arranged on the one surface of the semiconductor substrate and having a first opening 11a for exposing at least a part of the electrode; a conductive layer 12 arranged on the first insulation layer and electrically connected to the electrode through the first opening; a second insulation layer 13 arranged to cover the conductive layer and having a second opening 13a for exposing a part of the conductive layer; and a bump 14 arranged on the conductive layer exposed from the second opening. A region in contact with the bump within the conductive layer has a flat central region 12a and an outer region 12b forming a tilt, and the tilt has a negative angle toward the central region. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
