PREPREG AND METHOD FOR MANUFACTURING THE SAME, LAMINATE AND PRINTED WIRING BOARD

摘要

<P>PROBLEM TO BE SOLVED: To provide a prepreg and the like exhibiting high dielectric property when applied to a printed wiring board, and to provide a method for manufacturing a prepreg by which the prepreg can be efficiently manufactured. Ž<P>SOLUTION: The prepreg is obtained by impregnating a resin composition containing a thermosetting resin and an insulated ultrafine powder into a base material and carrying out drying, wherein the insulated ultrafine powder is obtained by disposing an insulating coating on a conductive ultrafine powder, wherein the conductive ultrafine powder comprises a carbon material of a predetermined shape, and the insulating coating is made of an insulating metal oxide or its hydrate and has an average thickness of 1-100 nm. The method for manufacturing the prepreg is also provided. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž