| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC handler which can respond more to electronic components different in size. SOLUTION: The IC handler 1 includes suction nozzles 868 which suck the electronic components and eight mobile units 89 which can move respectively independently in the directions of X and Y within a horizontal plane. The handler is so constituted that one suction nozzle 868 can be fitted to each of the mobile units 89 and that one suction nozzle 868 can be fitted to at least two mobile units 89. COPYRIGHT: (C)2010,JPO&INPIT
|
