THERMALLY CONDUCTIVE POLYAMIDE HAVING INCREASED FLOW CAPABILITY

摘要

The invention relates to thermoplastic moulding masses containing: A) 10 to 99 percent by weight of at least one thermoplastic polyamide; B) 0.01 to 30 percent by weight of at least one highly branched or hyper-branched polyether amine; C) 0.5 to 80 percent by weight of a thermally conductive filler; D) 0 to 70 percent by weight of further adjuncts, wherein the sum of the weight percentages of components A) to D) is 100 %.