| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating substrate made of an electric insulating material containing a polyphenylene ether resin, and a wiring substrate having superior adhesion strength between a wiring conductor embedded in a surface of the insulating substrate and an insulating resin layer such as a solder resist layer and a build-up resin layer etc. SOLUTION: A method of manufacturing the wiring substrate includes the steps of: preparing the insulating substrate 1 made of the electric insulating material containing the polyphenylene ether resin and having the wiring conductor 2, made of a copper foil, embedded in the principal surface; performing blast processing on the principal surface of the insulating substrate 1 and an exposed surface of the wiring conductor 2 embedded in the principal surface; etching away a surface layer part of 2 to 4μm in thickness from the exposed surface of the wiring conductor 2 having been subjected to the blast processing; carrying out roughening processing using a roughening liquid on the exposed surface of the wiring conductor 2 from which the surface layer part has been removed; and bonding an insulating resin layer 3 partially covering the exposed surface onto the principal surface of the insulating substrate 1 and the exposed surface of the wiring conductor 2. COPYRIGHT: (C)2010,JPO&INPIT |
