发明名称 Sensor Die Structure
摘要 A sensor is implemented in an integrated circuit. The sensor includes one or more sensor pads that are provided at or near a surface of the integrated circuit. One or more integrated circuit components such as a sense amplifier are provided in the integrated circuit die adjacent the sensor pads. One or more other components are provided in the integrated circuit die adjacent the sensor pads.
申请公布号 US2010176464(A1) 申请公布日期 2010.07.15
申请号 US20100748080 申请日期 2010.03.26
申请人 BROADCOM CORPORATION 发明人 BUER MARK
分类号 H01L27/14;H01L25/00 主分类号 H01L27/14
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